Samsung Electronics, a market leader and award-winning innovator in consumer electronics, semiconductors and telecommunications, has recently announce the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
The advanced 30 nanometer (nm) class technology provides better module performance and power features to deliver a substantially greener memory solution than the previous modules. “These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers,” said Hee Chang Yee, MD Samsung Electronics Pakistan.
